HP product materials restriction/substitution timeline1
Tributyl tin, triphenyl tin, Arsenic/arsenic compounds
and tributyl tin oxide
Bismuth/bismuth compounds
DfE programs started Certain azo Nickel on
Beryllium/beryllium compounds
colorants external
surfaces BFRs from circuit boards
Ozone-depleting Cadmium Lead in paint Chlorinated Lead PVC removed from
Mercury in bulbs
substances paraffins all packaging
1990 1995 2000 2005 2007
Nonylphenol
PBB, PBDE PVC from case plastics Mercury/mercury compounds Chlorinated Hexavalent BFRs in external Perfluorinated chemicals
and PBDO (except bulbs) hydrocarbons chromium case plastic parts
(including PFOS)
Most BFRs (including Certain Certain Phthalates
decaBDE) from case parts halogenated polychlorinated
PVC from wires/cables
diphenyl naphthalenes
methanes
Selenium/selenium compounds
1
Dates refer to when the materials restrictions were adopted by HP. Materials in gray text beyond 2007 have been identified by stakeholders as
potential materials of concern. Future possible restriction of those materials depends, in part, on the qualification of acceptable alternative materials.
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