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PHOSPHOROSILICAFILM 3 x 10_20                                                                           http://www.emulsitone.com/psif3x10_20.html



EMULSITONE COMPANY
19 Leslie Court
Whippany, New Jersey 07981
TEL. (973)386-0053
FAX (973)503-0256



PHOSPHOROSILICAFILM 3 x 1020

Phosphorosilicafilm 3 x 1020 is a dopant formulation designed to produce phosphorous diffused layers in Silicon
for Solar Cells. These layers may be produced routinely with sheet resistance profiles over the wafer surface
flatter than 1-2%. Similar reproducibility from wafer to wafer and from run to run is easily achieved. When
applied by spinning or spraying, a film is generated that consists of silica with phosphorous dissolved in it. This
phosphorous doped silica layer provides an erfc source, and the sheet resistance decreases linearly with the
square root of the diffusion time.

Phosphorosilicafilm 3 x 1020 contains ethyl alcohol as solvent. In addition to ethyl alcohol, methanol or isopropyl
alcohol may be used as diluents if it is desired to dilute the "as-received" formulation.

Phosphorosilicafilm 3 x 1020 is hygroscopic and for extended storage, the container should be securely fastened
to prevent access of water vapor. The bottle may be left open for reasonable periods of time with no deleterious
effects. After films have been applied by spinning or spraying, the wafers may be processed directly. However, if
it is desired to store the wafers for extended periods of time after film application and prior to diffusion, the films
should be hardened so that the layer is insoluble in water, and the wafers may be stored with no loss in doping
characteristics.

Application
The viscosity of Phosphorosilicafilm 3 x 1020 is quite low, and the material wets readily to silicon surface.
Approximately 1-1.5 ml will cover a four-inch wafer. For shallow penetrations where the source is not depleted,
the sheet resistance obtained is independent of spin speed. A spin speed should be selected which minimizes the
lip which builds up at the edge of the wafer. In 10 to 15 seconds of spinning, the film will be formed.

Diffusion
Diffusion is carried out in nitrogen atmosphere with 1-2% oxygen. Typical diffusion results are obtained as
shown in the table following. Refer to a standard textbook for your desired profile.




1 of 2 5/14/2002 1:28 PM
PHOSPHOROSILICAFILM 3 x 10_20 http://www.emulsitone.com/psif3x10_20.html




Diffusion Xj V/I Q
Temperature Time (min.)
(ohms/square) (Atoms/cm.)
(junction depth)
(o C)
925 15 0.13 18 1.0E15
925 30 0.18 12 1.4E15


1.5E15
950 15 0.18 12
950 30 0.26 9 2.1E15


2.1E15
975 15 0.26 8
2.9E15
975 30 0.37 6




Surface Condition
Phosphorosilicafilm 3 x 1020 will yield no surface damage or deposits. The phosphorous doped silica film is easily
removed in dilute HF solution.




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