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EPIKOTEâ„? Resin 862/
EPIKUREâ„? Curing Agent W System
General description Applicable fabrication processes
The EPIKOTE Resin 862/EPIKURE Curing Agent � For advanced composite structures
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W system consists of a bisphenol-F epoxy resin � Resin transfer molding (RTM)
and an aromatic amine for fabricating composite � Filament winding
parts using resin transfer molding (RTM) or fila-
ment winding. EPIKURE Curing Agent W does Chemical description
not contain methylene dianiline (MDA). Low � EPIKOTE Resin 862: Bisphenol-F (BPF)
viscosity and very long working life at room tem- epoxy resin
perature make this system versatile and easy to � EPIKURE Curing Agent W: Non-MDA,
process. EPIKURE Curing Agent 537 may be aromatic amine curing agent
utilized to decrease the gel time of the system � EPIKURE Curing Agent 537:
with little or no effect on mechanical properties. Substituted sulfur compound
Advantages
� Low room temperature viscosity
(about 2200 cP)
� Long working life (>20 hrs.)
� Low moisture absorption (2-2.5 wt%)
� Good epoxy performance characteristics
� Non-MDA aromatic amine
� High elongation
EPIKUREâ„?
E P I KOT E â„? EPONâ„? EPI-REZâ„? H E LOX Y â„? C A R D U R Aâ„? V E O VAâ„?
SC:1183-02 / EPIKOTEâ„? Resin 862/EPIKUREâ„? Curing Agent W System Page 2
Typical Properties Neat resin system properties � unaccelerated
The cured, unaccelerated, neat resin properties of the
EPIKOTE Resin 862 EPIKOTE Resin 862/EPIKURE Curing Agent W resin system as
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Epoxide equivalent weight (EEW) 166-177 a function of cure time at 121 °C (250 °F) and 177 °C (350 °F)
1
Viscosity @ 25 °C, (P) 25-45 are provided in Table 1. The isothermal and dynamic viscosity
2
Color, Gardner 2 max. curves of this system are shown in Figures 1 and 2.
3
Weight per gallon,
lb. at 20 °C (68 °F) 9.7-9.9 Neat resin system properties � accelerated
Flash point, Setaflash >149 °C (300 °F) The cured, accelerated, neat resin properties of the EPIKOTE
Resin 862/EPIKURE Curing Agent W resin system as a
EPIKURE Curing Agent W function of cure time at 121 °C (250 °F) and 177 °C (350 °F)
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Nitrogen Content, wt% 15.7-15.9 and accelerator concentration are provided in Tables 2 and 3.
4
Viscosity @ 25 °C, (cP) 100-300 The isothermal and dynamic viscosity curves of this system
2
Color, Gardner 7 max. at 1.0 phr (parts per hundred parts by weight of resin) of
3
Amine hydrogen equivalent wt (AHEW) 43-46 EPIKURE Curing Agent 537 are shown in Figures 3 and 4.
Weight per gallon,
lb. at 20 °C (68 °F) 8.4-8.6
Flash point, TCC 135 °C (275 °F)
EPIKURE 537 Curing Agent
Viscosity @ 25 °C, (P)2 6-70
Weight per gallon,
lb. at 20 °C (68 °F) 10.7-10.9
Flash point, PMCC >204 °C (400 °F)
Water content, wt%5 <2
MIXED SYSTEM
Mix ratio, parts by weight 100/26.4/0 100/26.4/1.0
Viscosity @ 25 °C, (P) 21-23 21-23
6
Pot life @ 25 °C, hr 21.5 7.9
7
Gel time @ 177 °C, min 15 4.1
8
Grams of resin containing one gram equivalent of epoxide.
1
ASTM D-1652-97 (Perchloric Acid Method).
ASTM-D 445-97 (Kinematic Viscosity, at 25°C,
2
by Ubbelohde Viscometer).
ASTM D 1544-80 (Gardner Color Scale).
3
Amine nitrogen content determined by acid-base titration.
4
ASTM D-2896-98 (Determination of Amine Nitrogen Content
and Amine Number).
ASTM E-203 (Karl Fisher method); at time of manufacture.
5
Brookfield viscosity.
6
Time to double initial room temperature viscosity
7
(Brookfield Viscometer).
Hot plate gel time.
8
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Table 1/ Properties of the EPIKOTEâ„? Resin 862/EPIKUREâ„? Curing Agent W resin system (100/26.4)
as a function of cure time
Cure schedule, hrs. at 350 °F 0.5 1.5 2.5
Density, g/cc � 1.2003 �
Specific heat, cal/g °C or BTU/lb °F
77 °F � � 0.31
140 °F � � 0.34
230 °F � � 0.39
Glass transition temperature
°F, Rheometrics 266 302 322
°F, DSC 273 289 313
Fracture toughness, Kq
Compact tension, psi-in 1/2 528 657 820
Flexure, RT/Dry
Strength, ksi No failure 12.5 18.6
Modulus, ksi 458 433 424
Elongation, % No failure 7.9 8.3
Flexure, Hot/Wet
Strength, ksi 8.1 9.4 8.9
Modulus, ksi 314 310 305
Elongation, % 4.6 5.5 6.4
Water absorption, wt% 2.2 2.1 2.1
Tensile, RT/Dry
Strength, ksi � � 11.4
Modulus, ksi � � 394
Elongation, % � � 7.1
Dielectric properties
Dielectric strength, V/mil 100 KHz � � 563
Dielectric constant � � 3.98
Dissipation � � 0.0293
Volume resistivity, ohm-cm � � 1.54E8
Cure schedule, hrs. at 250 °F 4 8
Glass transition temperature
°F, Rheometrics 235 273
°F, DSC � �
Fracture toughness, Kq
Compact tension, psi-in 1/2 541 583
Flexure, RT/Dry
Strength, ksi 18.4 18.0
Modulus, ksi 496 455
Elongation, % 7.5 8.5
Flexure, Hot/Wet
Strength, ksi 9.5 9.0
Modulus, ksi 300 295
Elongation, % 6.6 6.2
Water absorption, wt% 2.2 2.2
Tensile, RT/Dry
Strength, ksi 11.7 12.0
Modulus, ksi 471 431
Elongation, % 8.2 8.5
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Composite fabrication � resin transfer molding (RTM) Composite fabrication � filament winding
The low viscosity feature of the EPIKOTE Resin 862/EPIKURE The low viscosity and long room temperature pot life of the
Curing Agent W resin system permits low injection pressures, EPIKOTE Resin 862/EPIKURE Curing Agent W resin system
less fiber washout, high filler/fiber loading, and lower mold make it suitable for use in wet filament winding applications.
costs for RTM fabrication processes. An ambient temperature, The material may be used at room temperature or heated to
one-pot, RTM process may be employed in which the mixed reduce viscosity and facilitate fiber wetout. The initial mixed
resin/curing agent increases from 2200 cP initially to 5000 system viscosity of 2200 cP may be reduced to approximately
cP after about 36 hours. Processing data for this system is 1000 cP by heating the system to about 40 °C (100 °F). The
provided in Table 4. Alternatively, a two-pot resin and curing pot life at this temperature is in excess of 8 hours, sufficient
agent system can be used in which either the resin or both for winding large or complex parts. EPIKOTE Resin 862/EPIKURE
pots may be heated, generally less then 60 °C (140 °F) unless Curing Agent W is suitable for use with glass, carbon, and
otherwise required. A typical process includes injecting into aramid reinforcements. If air entrainment during mixing or
a heated mold at 121 °C (250 °F). The system viscosity at this fiber impregnation proves to be a problem, air release
temperature is on the order of 10 cP. Following the resin agents, such as BYKâ„? A-501* or equivalent, may be added.
injection, the system should be cured in the mold for between Cure may be conducted through internal heat sources in
0.5-1.5 hours at 177 °C (350 °F) followed by a 177 °C (350 °F) the mandrel or externally with ovens or both. Additional
post-cure for another hour. Molding and postcure tempera- resin/reinforcement compaction may be accomplished dur-
tures and times can be modified for optimum production. ing cure using traditional vacuum and pressure techniques.
Isothermal viscosity traces (see Figure 1) can be used to Frequently, a staged cure is most desirable in order to mini-
select the process conditions based on fill viscosity and mize resin runout and void formation in the composite. If
cure time criteria. EPIKURE Curing Agent 537 can be used shrinkwrap, vacuum bagging, or other external containment
to help modify the cure schedule according to processing is not utilized, it is recommended that the part be rotated
(Figure 3) and property requirements. Air release agents, during cure to ensure uniform resin distribution through the
such as BYK A-501* or equivalent, may be added if air part. A suggested cure cycle would include 1 hour at 121 °C
®
entrainment problems are encountered. Carbon fiber rein- (250 °F) plus 2.5 hours at 177 °C (350 °F).
forced composite test data are presented in Table 5.
*A product of BYK Chemie.
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Table 2/ Properties of the EPIKOTEâ„? Resin 862/EPIKUREâ„? Curing Agent W/EPIKUREâ„? Curing Agent
Accelerator 537 resin system (100/26.4/0.5) as a function of cure time
Cure schedule, hrs. at 350 °F 0.5 1.5 2.5
Density, g/cc � � 1.1947
Specific heat, cal/g °C or BTU/lb °F
77 °F � � 0.32
140 °F � � 0.35
230 °F � � 0.40
Glass transition temperature
°F, Rheometrics 266 284 302
°F, DSC 230 279 288
Fracture toughness, Kq
Compact tension, psi-in 1/2 578 698 727
Flexure, RT/Dry
Strength, ksi 17.1 17.2 17.5
Modulus, ksi 468 434 437
Elongation, % 9.9 8.6 8.5
Flexure, Hot/Wet
Strength, ksi 4.6 7.6 5.4
Modulus, ksi 282 300 313
Elongation, % 6.9 6.9 6.8
Water absorption, wt% 2.5 2.1 2.1
Tensile, RT/Dry
Strength, ksi � � 10.0
Modulus, ksi � � 408
Elongation, % � � 4.7
Dielectric properties
Dielectric strength, V/mil 100 KHz � � 578
Dielectric constant � � 3.96
Dissipation � � 0.0303
Volume resistivity, ohm-cm � � 1.50E8
Cure schedule, hrs. at 250 °F 4 8
Glass transition temperature
°F, Rheometrics 253 273
°F, DSC � �
Fracture toughness, Kq
Compact tension, psi-in 1/2 650 569
Flexure, RT/Dry
Strength, ksi 18.2 18.0
Modulus, ksi 478 463
Elongation, % 8.1 8.3
Flexure, Hot/Wet
Strength, ksi 9.0 8.9
Modulus, ksi 292 288
Elongation, % 5.1 5.2
Water absorption, wt% 2.2 2.3
Tensile, RT/Dry
Strength, ksi 11.7 12.0
Modulus, ksi 466 457
Elongation, % 10.3 8.7
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Table 3/ Properties of the EPIKOTEâ„? Resin 862/EPIKUREâ„? Curing Agent W/EPIKUREâ„? Curing Agent
Accelerator 537 resin system (100/26.4/1.0) as a function of cure time
Cure schedule, hrs. at 350 °F 0.5 1.5 2.5
Density, g/cc � � 1.2010
Specific heat, cal/g °C or BTU/lb °F
77 °F � � 0.30
140 °F � � 0.33
230 °F � � 0.41
Glass transition temperature
°F, Rheometrics 248 302 302
°F, DSC 219 293 300
Fracture toughness, Kq
Compact tension, psi-in 1/2 772 741 715
Flexure, RT/Dry
Strength, ksi 20.0 18.1 18.9
Modulus, ksi 506 450 453
Elongation, % 7.8 6.7 8.4
Flexure, Hot/Wet
Strength, ksi 9.3 8.6 9.1
Modulus, ksi 316 292 298
Elongation, % 4.9 5.5 5.2
Water absorption, wt% 2.3 2.1 2.0
Tensile, RT/Dry
Strength, ksi � � 11.5
Modulus, ksi � � 401
Elongation, % � � 6.8
Dielectric properties
Dielectric strength, V/mil 100 KHz � � 562
Dielectric constant � � 3.90
Dissipation � � 0.0289
Volume resistivity, ohm-cm � � 1.60E8
Cure schedule, hrs. at 250 °F 4 8
Glass transition temperature
°F, Rheometrics 235 291
°F, DSC � �
Fracture toughness, Kq
Compact tension, psi-in 1/2 620 543
Flexure, RT/Dry
Strength, ksi 19.0 17.8
Modulus, ksi 516 455
Elongation, % 7.3 8.5
Flexure, Hot/Wet
Strength, ksi 9.2 8.7
Modulus, ksi 295 283
Elongation, % 5.2 6.2
Water absorption, wt% 2.3 2.2
Tensile, RT/Dry
Strength, ksi 11.8 12.1
Modulus, ksi 484 425
Elongation, % 5.9 8.2
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Table 4/ Processing data for the EPIKOTEâ„? Resin 862/EPIKUREâ„? Curing Agent W resin system (26.4 phr)
as a function of EPIKUREâ„? Curing Agent Accelerator 537 level
EPIKUREâ„? Curing Agent Accelerator 537 level, phr 0.0 0.5 1.0
Pot life, hrs. at 77 °F 21.5 8.5 7.9
Gel time, min.
250 °F 94.6 45.4 30.5
300 °F 30.3 14.7 12.0
350 °F 15.0 7.4 4.1
Table 5/ Mechanical properties for the EPIKOTE® Resin 862/EPIKURE ® Curing Agent W resin system (26.4 phr)
fabricated using resin transfer molding (RTM) with unidirectional and 8 harness satin woven
graphite fabrics
Undirectional 8HS
0° Tensile, RT/Dry
Strength, ksi 314 �
Modulus, msi 18.4 �
Elongation, % � �
0° Compressive, RT/Dry
Strength, ksi 210 �
Modulus, msi 18.7 �
Elongation, % 1.3 �
0° Compressive, Hot/Dry
Strength, ksi 168 �
Elongation, % 1.0 �
0° Compressive, RT/Wet
Strength, ksi 212 �
Elongation, % 2.0 �
0° Flexure, RT/Dry
Strength, ksi � 122
Modulus, msi � 10.0
Elongation, % � 1.5
0° Short beam shear strength, ksi � 8.2
Tensile test method ASTM D-3039
Compressive test method Modified ASTM D-695
Flexure test method ASTM D-790
Short beam shear
Strength test method ASTM D-2344
RT/Dry Tested at ambient temperature/humidity (75 °F/50% R.H.)
Conditioned for 2 weeks in 200 °F (93 °C) water. Tested at ambient
RT/Wet
temperature/humidity (75 °F/50% R.H.)
Hot/Dry Tested at 200 °F (93 °C). No water conditioning.
8HS 8 Harness satin woven fabric with 3K Celion G30-500 fibers.
Uni Undirectional woven fabric with 3K Toray T400 fibers with fiberglass
cross fibers.
SC:1183-02 / EPIKOTEâ„? Resin 862/EPIKUE Curing Agent W System
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Figure 1/ Isothermal viscosity sweeps for EPIKOTEâ„? Resin 862/EPIKUREâ„? Curing Agent W using
a Rheometrics Parallel Plate Viscometer
100,000,000
121 °C
100 °C
10,000,000 (250 °F)
(212 °F)
1,000,000
100,000
10,000
80 °C
(176 °F)
1,000
100
10
160 240
40
0 120
80 200
Figure 2/ Viscosity cure sweep for EPIKOTE� Resin 862/EPIKURE� Curing Agent W at 5 °C/min. using
a Rheometrics Parallel Plate Viscometer
1,000,000,000
100,000,000
10,000,000
1,000,000
100,000
10,000
1,000
100
10
180 260
60
20 140
100 220
SC:1183-02 / EPIKOTEâ„? Resin 862/EPIKURE Curing Agent W System Page 9
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Figure 3/ Isothermal viscosity sweeps for EPIKOTEâ„? Resin 862/EPIKUREâ„? Curing Agent W/EPIKUREâ„?
Curing Agent Accelerator 537 using a Rheometrics Parallel Plate Viscometer
100,000,000
121 °C
(250 °F)
10,000,000
100 °C
(212 °F)
1,000,000
80 °C
(176 °F)
100,000
10,000
1,000
100
10
160 240
40
0 120
80 200
Figure 4/ Isothermal viscosity sweeps for EPIKOTEâ„? Resin 862/EPIKUREâ„? Curing Agent W/EPIKUREâ„?
Curing Agent Accelerator 537 at 5 °C/min. using a Rheometrics Parallel Plate Viscometer
1,000,000,000
100,000,000
10,000,000
1,000,000
100,000
10,000
1,000
100
10
180 260
60
20 140
100 220
SC:1183-02 / EPIKOTEâ„? Resin 862/EPIKURE Curing Agent W System Page 10
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Packaging, storage and shipping EPIKURE Curing Agent 537 is supplied in 1-quart, 1-gallon,
EPIKOTE Resin 862 is supplied in 55-gallon, DOT 17E, lined 5-gallon and 55-gallon drum quantities and is classified as
steel drums and in bulk and is classified as non-hazardous a corrosive liquid by DOT regulations (Code of Fed. Reg.
by DOT regulations (Code of Fed. Reg. Title 49). With time Title 49). Although stable at room temperature in an unopened
under certain storage conditions, EPIKOTE Resin 862 may container, this material will absorb moisture from the
develop crystals. Recommendations regarding storage con- atmosphere resulting in reduced activity. A dry, nitrogen
ditions and reconstitution procedures may be obtained by blanket is highly recommended to maintain activity. If you
contacting Resolution Performance Products� technical have any questions regarding this behavior, contact
support phone line at 1-800-TEC-EPON (1-800-832-3766). Resolution Performance Products� technical support phone
line at 1-800-TEC-EPON (1-800-832-3766).
EPIKURE Curing Agent W is supplied in 5-gallon and 55-
gallon drum quantities and is classified as non-hazardous
by DOT regulations (Code of Fed. Reg. Title 49). Although
stable at room temperature in an unopened container, this
material will become darker in color with exposure to the
atmosphere. If you have any questions regarding this
behavior, contact Resolution Performance Products� techni-
cal support phone line at 1-800-TEC-EPON (1-800-832-3766).
Resolution Performance Products
P.O. Box 4500
Houston, Texas 77210-4500
For product prices, availability, or order placement,
call our toll-free customer service number at:
1.877.859.2800
For sales in North and South America outside the United States, call:
1.832-366-2365
For literature and technical assistance,
visit our website at:
www.resins.com
SAFETY & HANDLING
These products are capable of producing adverse health effects ranging from minor skin irritation to serious systemic
effects. Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper
precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and
adherence to proper handling procedures. None of these materials should be used, stored, or transported until the
handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all
other products being used are understood by all persons who will work with them. Questions and requests for
information on Resolution Performance Products LLC (“RPPLLC�) products should be directed to your RPPLLC sales
representative, or the nearest RPPLLC sales office. Information and MSDSs on non-RPPLLC products should be
obtained from the respective manufacturer.
WARRANTY
NOTHING CONTAINED HEREIN CONSTITUTES AN OFFER FOR THE SALE OF ANY PRODUCT. ALL PRODUCTS SUPPLIED
BY RESOLUTION PERFORMANCE PRODUCTS LLC (“RPPLLC�) ARE SUBJECT TO THE TERMS AND CONDITIONS OF
THE APPLICABLE SALES CONTRACT AND NOTHING CONTAINED HEREIN SHALL AMEND OR MODIFY ANY SUCH
CONTRACT. SUBJECT TO THE FOREGOING, RPPLLC WARRANTS ONLY THAT ITS PRODUCTS WILL MEET SPECIFI-
CATIONS SET FORTH IN THE APPLICABLE SALES CONTRACT. RPPLLC MAKES NO OTHER WARRANTIES, EITHER
EXPRESS OR IMPLIED, WITH RESPECT TO ITS PRODUCTS OR THE RESULTS TO BE OBTAINED FROM THE USE THEREOF,
OR WITH RESPECT TO ANY INFORMATION PROVIDED BY RPPLLC, INCLUDING WITHOUT LIMITATION THAT ANY
PRODUCT WILL BE MERCHANTABLE OR FIT FOR ANY PARTICULAR PURPOSE OR THAT THE USE OF ANY PRODUCT
OR INFORMATION PROVIDED BY RPPLLC WILL NOT INFRINGE ANY PATENT OR OTHER INTELLECTUAL PROPERTY
RIGHTS. ALL SUCH WARRANTIES ARE HERBY DISCLAIMED AND EXCLUDED.
© 2001 Resolution Performance Products LLC. All rights reserved. SC:1183-01
Printed in the U.S.A. 09/02
EPIKUREâ„?
E P I KOT E â„? EPONâ„? EPI-REZâ„? H E LOX Y â„? C A R D U R Aâ„? V E O VAâ„?
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