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File Name: resins_com---sc1516.asp
                                                                                  Product Data Sheet




HELOXY鈩? Modifier 67



SC: 1516 Re-issued: February 2006

Introduction HELOXY鈩? Modifier 67 is a commercial grade, diglycidyl ether of 1,4-butanediol and is
primarily used as a reactive diluent or viscosity reducer for all classes of epoxy resins.

鈥?
Features Reduces viscosity while maintaining most cured state properties
鈥? Improves wetting characteristics
鈥? Facilitates air release
鈥? Provides solubility in ethanol/water solutions

鈥? To improve air release and wetting characteristics in electrical, potting,
Suggested Uses
encapsulation, and impregnation applications
鈥? To maintain high reactivity yet provide workable viscosity at room temperature
when using novolac or other high functionality epoxy resins
鈥? As a thermosetting resin in textile and paper applications

Typical Properties Property Test Method Unit Value
Epoxide Equivalent Weight ASTM D1652 g/eq 123.4 鈥? 136.6
1
Viscosity, @ 25掳C ISO 12058-1 10 鈥? 20
mPa鈰卻
Color ASTM D1544 Gardner 1 max.
Density lbs/gal 9.10 鈥? 9.30
Flash Point, Setaflash ASTM D3278 掳F >200
1
H枚ppler Falling Ball (1 mPa鈰卻 = 1 cP)




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SC: 1516 HELOXY Modifier 67 Page 2



General Information HELOXY 67 is compatible with bisphenol based epoxy resins, peroxidized olefins, and higher
functionality epoxy resins. Concentrations of up to 40 percent of HELOXY 67 have been
employed for viscosity reduction. Performance properties of systems containing this resin
are maintained at higher modification concentrations than is possible with monoepoxide
diluents.

Effect of HELOXY 67 modifications on the properties of various EPON鈩? Resin 828 based
systems is demonstrated by data presented in Table 1. Substituting HELOXY 67 for Epon 828
or other unmodified resins generally results in slight increases in flexibility. As with all
diluting modifiers, use of HELOXY 67 decreases chemical resistance and elevated
temperature performance.

To minimize such losses, the lowest concentration of HELOXY 67 necessary to obtain desired
reduction in viscosity should be used. The viscosity reduction efficiency of HELOXY 67 when
blended with Epon 828 is compared to that of other HELOXY modifiers by data illustrated in
Figure 1.

When formulating with HELOXY 67, the concentration of curing agent to be used will likely
be different than in the case of an unmodified system. The proper curing agent combining
ratio should always be calculated in order to ensure proper stoichiometric balance.


Figure 1 / Viscosity Dilution Effectiveness of HELOXY Modifiers




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SC: 1516 HELOXY Modifier 67 Page 3

Storage HELOXY Modifier 67 should be stored in tightly sealed containers in a dry location at normal
room temperature.

Some epoxy materials can crystallize during storage. The tendency to do so is affected by
storage conditions, composition, and other factors. Should crystallization occur, it may be
converted to liquid by opening the drum bung and gently warming to temperatures not to
exceed 50 掳C (122 掳F).

For more storage information, please visit the 鈥淪helf Life鈥? section of our website at:
www.hexion.com




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SC: 1516 HELOXY Modifier 67 Page 4



Table 1 / Effects of HELOXY Modifier 67 on Properties of Epoxy Resin Systems

Aliphatic Amine Anhydride
Method Units A B C D
Composition (parts by wt)
EPON鈩? Resin 828 pbw 100 85 100 85
HELOXY Modifer 67 pbw --- 15 --- 15
EPIKURE Curing Agent 3234 pbw 12.9 14 --- ---
Methyltetrahydrophthalic Anhydride pbw --- --- 79 84
Diethylaminoethanol pbw --- --- 0.5 0.5

Handling Properties at 25掳C
Viscosity, Resin Portion cP 13,250 1,560 13,250 1,560
Gel time 40 45 10 45
at 23 掳C, 100 g minutes 44 39 --- ---
at 150 掳C, stroke method minutes --- --- 5.2 5.7
Peak Exotherm, 100 gram mass @ 23掳C 掳C 223 222 --- ---

Cured State Properties 1
Heat Deflection Temperature ASTM D648 掳C 67 64 117 101
Tensile strength Ultimate ASTM D638 psi 9,600 12,400 13,500 12,900
Tensile elongation at Break % 1.7 4.2 6.3 6.3
6
Tensile Modulus 10 psi 0.59 0.53 0.51 0.50
Flexural Strength Ultimate ASTM D790 psi 16,700 19,000 21,900 20,900
6
Initial Flexural Modulus 10 psi 0.57 0.53 0.48 0.49
Compressive Strength Ultimate psi 19,100 12,000 46,000 51,000
Compressive Yield Strength psi 10,100 9,900 16,500 16,000
Izod Impact 鈥? notch ASTM D256 ft.鈥b./inch 0.40 0.52 0.43 0.63
Weight Loss after 24 hrs @ 150掳C % 0.29 0.28 0.04 0.08
2
Percent Absorption
In Water
24 hrs % 0.17 0.21 0.14 0.13
1 week % 0.46 0.58 0.34 0.33
In 5% Acetic Acid
24 hrs % 1.53 4.64 0.13 0.13
1 week % 4.83 10.80 0.34 0.32
3
In Solvent
24 hrs % 0.88 1.44 0.04 0.04
1 week % 1.97 2.38 0.09 0.12
Electrical Properties
5
Dielectric Constant ASTM D150 4.26 4.43 3.61 3.68
5
Dissipation Factor 0.022 0.026 0.014 0.015
--------------------
1
Determined on 0.125 thick specimens at 23 掳C. Systems A and B cured 2 weeks at 25 掳C. Systems C and D cured 2 hours at 93 掳C plus 2 hours at 175掳C.
2
Weight gain of 3 inch x 1 inch x 0.125 inch specimens totally immersed in reagent at 25 掳C.
3
50:50 by weight mix of isopropanol and xylene.
4
Determined at 106 hertz.




EPIKOTE鈩? EPON鈩? EPIKURE鈩? EPI-REZ鈩? HELOXY鈩? CARDURA鈩? VEOVA鈩?
For product prices, availability, or order placement,
call our toll-free customer service number at:
1-877-859-2800

For sales in North and South America outside the United States, call:
1-832-366-2365

For literature and technical assistance, visit our website at:
www.hexionchem.com


SAFETY & HANDLING
These products are capable of producing adverse health effects ranging from minor skin irritation to serious
systemic effects. Exposure to these materials should be minimized and avoided, if feasible, through the
observance of proper precautions, use of appropriate engineering controls, and proper personal protective
clothing and equipment, and adherence to proper handling procedures. None of these materials should
be used, stored, or transported until the handling precautions and recommendations as stated in the
Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all
persons who will work with them. Questions and requests for information on Hexion Specialty
Chemicals, Inc. ("Hexion") products should be directed to your Hexion sales representative, or the nearest
Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the
respective manufacturer.




Hexion Specialty Chemicals, Inc. For worldwide locations visit
PO Box 4500
hexionchem.com
Houston, TX 77210-4500
漏 2005 Hexion Specialty Chemicals, Inc. Printed in U.S.A.
庐 and 鈩? Licensed trademarks of Hexion Specialty Chemicals, Inc. *Responsible Care is a registered service mark of the American Chemistry Council.

HEXION SPECIALTY CHEMICALS MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING ANY PRODUCT OR THE MERCHANTABILITY OR FITNESS
THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION SPECIALTY CHEMICALS, except that the
product shall conform to contracted specifications, and that the product does not infringe any valid United States patent. The information provided herein was believed
by Hexion Specialty Chemicals to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the
user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the
product and to determine the suitability of the product for its intended use.




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